Industry

Vacuum pumps for semiconductors, electronics and displays

Wafer fabrication, coating, display production and PCB assembly need vacuum in very different ranges: from particle-free process vacuum for etching and deposition and load-lock chambers to the vacuum for pick & place and handling. Pfeiffer Vacuum and Busch name dry backing pumps for this, Becker and Elmo Rietschle pumps for assembly, drying and extraction, Atlas Copco pumps for the house vacuum of the fab. Below you can see which series the manufacturers themselves name for these tasks – 519 models from 7 manufacturers.

Compare 519 modelsSee the applications

  • 519Models
  • 62Series
  • 7Manufacturers
  • 8Applications
Circuit board with electronic components
Circuit board with electronic components

In short

Semiconductors, electronics and displays: vacuum pumps – the key facts

  • Process vacuumFor wafer etching Pfeiffer Vacuum names 10⁻²–10⁻³ hPa, for stripping and ashing about 1 hPa at 600–1,800 (3,000) m³/h and for ALD 10⁻¹–5 mbar at 1,800–4,500 m³/h.
  • Dry backing pumpsFor wafer fabrication Pfeiffer Vacuum names dry pumps – multi-stage Roots pumps, screw and scroll vacuum pumps – because the by-products of many processes are corrosive or powdery. Busch names the COBRA Semicon series for this.
  • House vacuumFor the central vacuum of IC manufacturing Atlas Copco states 100–400 mbar abs. and 2,000–8,000 m³/h, over 12,000 m³/h in large fabs – around the clock, with heat recovery of up to 75 %.
  • Pick & placeFor the electronics industry Becker names precise vacuum with low pulsation and vibration, above all for pick & place, and a case study with 20,000 maintenance-free operating hours.

Applications

Semiconductors, electronics and displays: what vacuum pumps are used for

For each application: what the vacuum does and which series the manufacturers name for it. The information comes from the manufacturers’ own pages.

Etching, stripping and ion implantation

In dielectric, conductor and polysilicon etching, in stripping and ashing and in ALE, the processes work at 10⁻²–10⁻³ hPa according to Pfeiffer Vacuum, with dry backing pumps and turbo pumps; in stripping at about 1 hPa with 600–1,800 (3,000) m³/h. Busch names the COBRA Semicon series for polysilicon etching and ion implantation; Pfeiffer Vacuum names ACP and TORRI for implantation, A4 and COBRA BC/DS for etching, and for EUV lithography particle-free vacuum with a high H₂ flow in the light source (ACP, HiLobe).

More on Etching, stripping and ion implantation →

Thin-film deposition: CVD, PECVD, ALD and PVD

Pfeiffer Vacuum names the A4 series for PECVD/SACVD, PVD, ALD, LPCVD/diffusion and MBE and points out that the by-products are corrosive or powdery; for ALD Pfeiffer states 10⁻¹–5 mbar at 1,800–4,500 m³/h, for MBE about 10⁻¹¹ hPa. Busch names the COBRA Semicon series for ALD, PECVD, PVD and LPCVD/diffusion and COBRA DS for CVD/PECVD layers such as anti-reflective coatings. For decorative, optical and glass coating both manufacturers name further series – Busch COBRA Industry, R5, PANDA/PUMA and MINK, Pfeiffer ACP, DuoVane, HiLobe, HiScroll and TORRI.

More on Thin-film deposition: CVD, PECVD, ALD and PVD →

Load-lock and transfer chambers

According to Pfeiffer Vacuum, load locks stay particle-free under vacuum and must be pumped down quickly; named are A 100 L and A 200 L with 100 and 200 m³/h respectively for 10⁻¹–10⁻² hPa, as well as A4, ACP, TORRI and COBRA DS. For load-lock chambers Busch names COBRA (NX, DS, NC), PANDA WV and PUMA WY, so that wafers are transferred in without a pressure surge.

More on Load-lock and transfer chambers →

Pick & place, chip mounters and handling

Vacuum holds the suction cups during automated lifting and transfer. Becker names PCB assembly with chip mounters, automatic loading and unloading machines and gantry systems for this, and KVT, VT and SV as series; a case study names 20,000 maintenance-free operating hours. For vacuum lifters Becker gives SV with 195–1,250 m³/h and −290 to −440 mbar, for robotic pick & place the claw vacuum pumps BCV (BCV 100: 50 mbar, BCV 300: 150 mbar). Elmo Rietschle names pick & place for electronics with the G, L and V families.

More on Pick & place, chip mounters and handling →

House vacuum for assembly, transport, cutting and testing

Atlas Copco names central vacuum for all handling steps of IC manufacturing – assembly, transport, cutting, moulding, testing – with 100–400 mbar abs. and 2,000–8,000 m³/h, over 12,000 m³/h in large fabs. Named are GHS VSD+, DZS VSD+ (Class 0) and LRP VSD+, clean and stable house vacuum around the clock, heat recovery of up to 75 % and precise pressure control for several lines. Leybold lists electronics manufacturing for NOVADRY NDi with central vacuum below 100 mbar.

More on House vacuum for assembly, transport, cutting and testing →

Vacuum drying of components and assemblies

Elmo Rietschle and Becker list the drying of electronic components without describing it further; Becker also names drying and impregnating in autoclaves and the evacuation of drying plants. As a general rule, according to Becker, water evaporates under vacuum from as low as 20–40 °C (named for VADS and U). For vacuum drying Elmo Rietschle names versions with high water vapour tolerance (V-VC 40–150, 40–180 m³/h) and, for short evacuation times, the S-VSI 300 with up to 380 m³/h and 0.1 mbar (abs.).

More on Vacuum drying of components and assemblies →

Inspection and metrology: CD-SEM, analysis, leak detection

For low-vibration wafer metrology with CD-SEM Pfeiffer Vacuum names 10⁻⁵–10⁻⁷ hPa and ACP and HiScroll as backing pumps, and A 100/200 L, ACP and TORRI for inspection and metrology as a whole. According to Pfeiffer, residual gas analysis measures the gas composition in the vacuum (contamination, leaks, outgassing) at no more than 10⁻⁴ hPa at the analyser. In helium leak detection, a leak detector locates helium sprayed on from outside at about 10⁻⁷–10⁻⁹ mbar·l/s; as backing pumps Pfeiffer names ACP, DuoVane and HiScroll.

More on Inspection and metrology: CD-SEM, analysis, leak detection →

PCB manufacturing: fixing, soldering, wet processes

Becker names fixing in semiconductor test processes, solder fume extraction and blowing in and blowing off in PCB wet processes, without describing them. As a general rule, according to Becker, vacuum clamping holds parts in place so that they can be machined precisely, and when mixtures of gas, liquid and solids are extracted, a separator protects the pump. Edwards lists PCB manufacturing and electronics testing for scroll vacuum pumps.

  • BeckerVT, VX, KVT, KVX, VTLF, VXLF, O, U, U4, VADS, SV, VASF series from Becker’s vacuum clamping page
  • Edwardslists PCB manufacturing and electronics testing for scroll vacuum pumps without a series

More on PCB manufacturing: fixing, soldering, wet processes →

Manufacturers and series

Semiconductors, electronics and displays: 7 manufacturers, 62 series

Listed are the series the manufacturer itself names for this industry. “Show only …” sets the filter of the product overview.

Product overview

Semiconductors, electronics and displays: all 519 models compared

Use the filters on the left to narrow the selection – by manufacturer, technology and the models’ key figures, for 50 or 60 Hz.

Atlas Copco AWL series 11 models

AWL 4000Pumping speed 4,290 m³/h 50 HzUltimate pressure 160 mbarRated motor power 160 kW 50 HzVariants
AWL 5500Pumping speed 5,580 m³/h 50 HzUltimate pressure 160 mbarRated motor power 185 kW 50 HzVariants
AWL 7000Pumping speed 6,900 m³/h 50 HzUltimate pressure 160 mbarRated motor power 185 kW 50 HzVariants 8
AWL 9500Pumping speed 9,200 m³/h 50 HzUltimate pressure 160 mbarRated motor power 200 kW 50 HzVariants 8
AWL 12500Pumping speed 12,500 m³/h 50 HzUltimate pressure 160 mbarRated motor power 280 kW 50 HzVariants 8
AWL 15000Pumping speed 15,000 m³/h 50 HzUltimate pressure 160 mbarRated motor power 315 kW 50 HzVariants 9
AWL 17500Pumping speed 17,400 m³/h 50 HzUltimate pressure 160 mbarRated motor power 400 kW 50 HzVariants 8
AWL 21500Pumping speed 21,300 m³/h 50 HzUltimate pressure 160 mbarRated motor power 450 kW 50 HzVariants 8
AWL 26000Pumping speed 25,800 m³/h 50 HzUltimate pressure 160 mbarRated motor power 560 kW 50 HzVariants 6
AWL 30000Pumping speed 30,000 m³/h 50 HzUltimate pressure 160 mbarRated motor power 630 kW 50 HzVariants 4
AWL 37500Pumping speed 36,600 m³/h 50 HzUltimate pressure 160 mbarRated motor power 800 kW 50 HzVariants

Atlas Copco DHS VSD+ series 1 model

DHS 3000 VSD+Pumping speed 3,044 m³/h 50 Hz3,044 m³/h 60 HzUltimate pressure 350 mbarRated motor power 55 kW 50 Hz55 kW 60 HzVariants 4

Atlas Copco DWS VSD+ series 6 models

DWS 160 VSD+Pumping speed 160 m³/h 50 Hz160 m³/h 60 HzUltimate pressure 0.01 mbarRated motor power 7.5 kW 50 Hz7.5 kW 60 HzVariants 1
DWS 250 VSD+Pumping speed 250 m³/h 50 Hz250 m³/h 60 HzUltimate pressure 0.01 mbarRated motor power 7.5 kW 50 Hz7.5 kW 60 HzVariants 1
DWS 450 VSD+Pumping speed 450 m³/h 50 Hz450 m³/h 60 HzUltimate pressure 0.01 mbarRated motor power 11 kW 50 Hz11 kW 60 HzVariants 3
DWS 750 VSD+Pumping speed 740 m³/h 50 Hz740 m³/h 60 HzUltimate pressure 0.01 mbarRated motor power 22 kW 50 Hz22 kW 60 HzVariants 3
DWS 160/1750 VSD+Pumping speed 1,200 m³/h 50 Hz1,200 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 12 kW 50 Hz12 kW 60 HzVariants 1
DWS 250/2600 VSD+Pumping speed 1,900 m³/h 50 Hz1,900 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 15 kW 50 Hz15 kW 60 HzVariants 1

Atlas Copco DZS series 8 models

DZS 065APumping speed 65 m³/h 50 Hz78 m³/h 60 HzUltimate pressure 50 mbarRated motor power 1.8 kW 50 Hz2.2 kW 60 HzVariants 12
DZS 065APPumping speed 65 m³/h 50 Hz78 m³/h 60 HzUltimate pressure Rated motor power 3.7 kW 50 Hz3.7 kW 60 HzVariants 5
DZS 150APumping speed 150 m³/h 50 Hz180 m³/h 60 HzUltimate pressure 50 mbarRated motor power 3.7 kW 50 Hz3.7 kW 60 HzVariants 12
DZS 150APPumping speed 150 m³/h 50 Hz180 m³/h 60 HzUltimate pressure Rated motor power 11 kW 50 Hz15 kW 60 HzVariants 6
DZS 300APPumping speed 238 m³/h 50 Hz280 m³/h 60 HzUltimate pressure Rated motor power 19 kW 50 Hz22 kW 60 HzVariants 6
DZS 300APumping speed 300 m³/h 50 Hz360 m³/h 60 HzUltimate pressure 140 – 200 mbarRated motor power 6.2 kW 50 Hz7.5 kW 60 HzVariants 12

Atlas Copco DZS VSD+ series 5 models

Atlas Copco GHS VSD+ series 21 models

Atlas Copco GVS VSD+ series 4 models

Atlas Copco LRP VSD+ series 3 models

Becker BCV series 7 models

Becker KVT series 4 models

Becker KVX series 4 models

Becker O series 6 models

Becker RBP series 3 models

Becker SV series 16 models

Becker U4 series 6 models

Becker U series 8 models

Becker VADS series 3 models

Becker VARIAIR RV series 1 model

Becker VASF series 6 models

Becker VATP series 1 model

Becker VTLF series 6 models

Becker VT series 7 models

Becker VXLF series 5 models

Becker VX series 4 models

Busch COBRA Industry series 36 models

Busch COBRA Semicon series 22 models

Busch MINK series 32 models

Busch PANDA/PUMA series 26 models

Busch R5 series 58 models

Edwards GV series 2 models

Edwards GXS series 10 models

Elmo Rietschle G-BH1 series 25 models

Elmo Rietschle G-BH2 series 9 models

Elmo Rietschle G-BH7 series 15 models

Elmo Rietschle G-BH9 series 1 model

Elmo Rietschle G-BH100 series 1 model

Elmo Rietschle L-BL2 series 7 models

Elmo Rietschle L-BV2 series 4 models

Elmo Rietschle L-BV3 series 1 model

Elmo Rietschle L-BV5 series 5 models

Elmo Rietschle L-BV7 series 4 models

Elmo Rietschle S-SVT series 11 models

Elmo Rietschle S-VSI series 1 model

Elmo Rietschle V-KTR series 4 models

Elmo Rietschle V-VCA/VCE series 2 models

Elmo Rietschle V-VCB series 2 models

Elmo Rietschle V-VCS series 13 models

Elmo Rietschle V-VCX series 7 models

Elmo Rietschle V-VGD series 2 models

Elmo Rietschle V-VTN series 3 models

Elmo Rietschle V-VTR series 2 models

Leybold CLAWVAC series 5 models

Leybold NOVADRY series 4 models

Pfeiffer Vacuum A4 series 12 models

Pfeiffer Vacuum A 100/200 L series 3 models

Pfeiffer Vacuum ACP series 4 models

Pfeiffer Vacuum DuoVane series 12 models

Pfeiffer Vacuum HiLobe series 17 models

Pfeiffer Vacuum HiScroll series 4 models

Pfeiffer Vacuum SmartVane series 2 models

Pfeiffer Vacuum TORRI series 4 models

Pfeiffer Vacuum UnoLine Plus series 1 model

Model comparison

Models a manufacturer no longer carries in its current range are listed in its “Outdated models” section.

Selection

Semiconductors, electronics and displays: choosing a vacuum pump

What the manufacturers highlight for use in this industry.

Process gases and by-products

According to Pfeiffer Vacuum, the by-products of many deposition processes are corrosive or powdery; dry backing pumps are named (multi-stage Roots, screw, scroll). For display processes such as CVD, etching, PVD, implantation and encapsulation Edwards names vacuum together with exhaust gas abatement. For applications with high gas throughput Busch and Pfeiffer name the COBRA Semicon series (COBRA DS).

Particles, vibration, pulsation

According to Pfeiffer Vacuum, wafer fabrication must stay free of particles and contamination; for CD-SEM and electron microscopy Pfeiffer Vacuum names low-vibration pumps. For pick & place Becker names precise vacuum with low pulsation and vibration.

Installation location

Pfeiffer Vacuum distinguishes between pumps in the cleanroom, in the sub-floor (point of use) and in the sub-fab. Atlas Copco names clean, stable house vacuum around the clock; Leybold names central vacuum below 100 mbar for electronics manufacturing.

Energy and speed control

For central vacuum systems with speed-controlled pumps Atlas Copco states up to 50 % less energy and CO2 and heat recovery of up to 75 %; for networks with speed-controlled pumps Leybold names energy savings of often more than 50 % (Leybold figure).

Frequently asked questions

Semiconductors, electronics and displays: frequently asked questions about vacuum pumps

Which vacuum pump is suitable for semiconductor manufacturing?

For wafer fabrication Pfeiffer Vacuum names dry backing pumps – multi-stage Roots pumps, screw and scroll vacuum pumps – and as series A 100/200 L, A4, ACP, COBRA DS/BC and TORRI, depending on the process in the cleanroom, in the sub-floor or in the sub-fab. Busch names the COBRA Semicon series from load lock to particle-generating processes such as polysilicon etching, stripping, PECVD, PVD and ALD. For display processes Edwards names GXS and GV together with exhaust gas abatement.

How much vacuum does wafer etching need?

For dielectric, conductor and polysilicon etching Pfeiffer Vacuum states 10⁻²–10⁻³ hPa, for stripping and ashing about 1 hPa at 600–1,800 (3,000) m³/h. Named are A4 and COBRA BC/DS for etching and A4 and COBRA BC for stripping; for polysilicon etching and stripping/ashing Busch names the COBRA Semicon series.

Which backing pump for ALD and CVD?

For ALD Pfeiffer Vacuum names 10⁻¹–5 mbar at 1,800–4,500 m³/h, and for ALD, PECVD and LPCVD/diffusion the A4 series and COBRA DS; according to Pfeiffer, the by-products are corrosive or powdery. Busch names the COBRA Semicon series for ALD, PECVD, PVD and LPCVD/diffusion and COBRA DS for CVD/PECVD layers such as anti-reflective coatings.

Which vacuum pump for load-lock chambers?

Pfeiffer Vacuum names A 100 L and A 200 L with 100 and 200 m³/h respectively for 10⁻¹–10⁻² hPa, plus A4, ACP, TORRI and COBRA DS; the load locks stay particle-free under vacuum and are pumped down quickly. Busch names COBRA (NX, DS, NC), PANDA WV and PUMA WY, so that wafers are transferred in without a pressure surge.

Which vacuum pump for pick & place and chip mounters?

For PCB assembly with chip mounters and for pick & place in general Becker names the KVT, VT and SV series and precise vacuum with low pulsation and vibration; a case study names 20,000 maintenance-free operating hours. For robotic pick & place Becker names the claw vacuum pumps BCV (BCV 100: 50 mbar, BCV 300: 150 mbar), for tube and column lifters the side channel blowers SV with 195–1,250 m³/h. Elmo Rietschle names pick & place for electronics with the G, L and V families.

Dry-running or oil-lubricated in semiconductor manufacturing?

For wafer fabrication Pfeiffer Vacuum names only dry backing pumps, because production must stay free of particles and contamination and the by-products are corrosive or powdery; Busch names the COBRA Semicon series for this. Outside the process chambers, for example in pick & place and handling, Becker names dry-running and oil-lubricated rotary vane, screw, claw and side channel pumps for the electronics industry. For the house vacuum Atlas Copco names DZS VSD+ in Class 0 in addition to GHS VSD+ and LRP VSD+.

Which vacuum pump for EUV lithography?

For EUV lithography Pfeiffer Vacuum names particle-free vacuum and a high H₂ flow in the light source, for structures below 10 nm; ACP and HiLobe are named as backing pumps, and for lithography in general A 100/200 L, A4, ACP and TORRI.

Which vacuum pump for scanning electron microscopes and CD-SEM?

For CD-SEM in wafer metrology Pfeiffer Vacuum names 10⁻⁵–10⁻⁷ hPa and low-vibration backing pumps, ACP and HiScroll. According to Pfeiffer, electron microscopy needs a scatter-free electron beam and low-vibration pumps; named are diaphragm, multi-stage Roots and scroll pumps, and HiScroll as a series.

Which vacuum pump for display manufacturing (TFT, LCD, OLED)?

For the manufacture of flat panel displays (TFT, LCD, AMOLED) Pfeiffer Vacuum names the A4 series and COBRA DS. For displays Busch names the COBRA Industry and the COBRA Semicon series, and high vacuum for the production of flat panel displays. For display processes – CVD, etching, PVD, implantation, encapsulation – Edwards names vacuum with exhaust gas abatement and the GXS and GV series.

How are leaks found in vacuum systems in semiconductor manufacturing?

Pfeiffer Vacuum describes helium leak detection: helium is sprayed on from outside, and a leak detector on the system locates the leaks at about 10⁻⁷–10⁻⁹ mbar·l/s; named are the ASM 340/310/390/392 leak detectors and ACP, DuoVane and HiScroll as backing pumps. Residual gas analysis also shows contamination, leaks and outgassing in the vacuum.

A pump at each machine or a central vacuum system?

A central system in a room of its own keeps noise and heat away from production and matches its output to the demand. Central vacuum systems are planned and built by Eugen Theis Vakuum, a company of the Ehrler & Beck group – more under Central Vacuum.

Does Ehrler & Beck also supply spare parts and service?

Yes. Ehrler & Beck offers original spare parts and accessories as well as maintenance and repair.

Which pump suits your process?

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