Application
Vacuum pumps for semiconductor processes: etching, implantation, lithography
Etching, ion implantation, lithography and the deposition processes of wafer fabrication take place in evacuated process chambers: the vacuum removes the air, maintains the process pressure for plasma, ion beam and reaction gases and carries off the reaction products. For etching and cleaning semiconductors, Pfeiffer Vacuum names 10⁻² to 10⁻³ hPa, for stripping about 1 hPa and for EUV lithography a particle-free vacuum with a high hydrogen flow. Below you can see how the application works, what vacuum the manufacturers name and which of their series are intended for it – 62 models from 2 manufacturers.
- 62Models
- 6Series
- 2Manufacturers
- 10⁻²–10⁻³ hPaProcess pressure for etching and cleaning (Pfeiffer Vacuum)
Touch the points: each part of the system explains itself.
In short
Semiconductor processes (etch, implant, lithography): the key facts
- Process pressureFor etching and cleaning semiconductors, Pfeiffer Vacuum names 10⁻² to 10⁻³ hPa, and for stripping and ashing about 1 hPa.
- Pumping speedFor etching and stripping, Pfeiffer Vacuum names dry backing pumps with 600 to 1,800 m³/h, peaking at 3,000 m³/h.
- EUV lithographyFor EUV lithography with structures below 10 nm, Pfeiffer Vacuum names a particle-free vacuum and a high H₂ flow in the light source – with HiLobe and ACP (the ADH, which is also named, is not in our range).
- Process classesBusch classes metal etching, implantation, HDP, CVD, RTP, epitaxy, SA/MO/PE/LP-CVD and ALD as demanding processes, and PVD, PVD pre-clean, RTA, stripping/ashing and oxide and silicon etching as medium ones – without describing them in more detail.
Operating principle
How it works: Semiconductor processes (etch, implant, lithography)
The drawing shows the basic principle in section. The systems and pumps of the individual manufacturers differ in detail.
- LoadingThe wafer enters the evacuated process chamber through a load lock without the chamber being vented.
- ProcessingProcess gas flows in, and plasma or an ion beam processes the wafer; meanwhile the pumping station maintains the pressure – according to Pfeiffer Vacuum, 10⁻² to 10⁻³ hPa for etching and about 1 hPa for stripping.
- Pumping outReaction products and residual gas are pumped out, the wafer is unloaded through the lock and the chamber is ready for the next wafer.
Vacuum and sizing
Semiconductor processes (etch, implant, lithography): how much vacuum is needed
What the manufacturers say about pressure, pumping speed and sizing.
Which vacuum
Pfeiffer Vacuum: etching and cleaning 10⁻² to 10⁻³ hPa, stripping about 1 hPa; EUV lithography particle-free with a high H₂ flow. Busch ranks the processes by how demanding they are: demanding are metal etching, implantation, HDP, CVD, RTP, epitaxy and ALD, medium are PVD, RTA, stripping and oxide/silicon etching.
Which pumping speed
For etching and stripping, Pfeiffer Vacuum names 600 to 1,800 m³/h, peaking at 3,000 m³/h, with dry backing pumps. Busch names the COBRA Semicon series for polysilicon etching (15 products) and ion implantation (1 product).
Technology
Semiconductor processes (etch, implant, lithography): the vacuum pumps the manufacturers name
Listed are the series the manufacturer itself names for this application. “Show only …” sets the filter of the product overview.
Roots vacuum pumps
40 models · 14–13,540 m³/h
Screw vacuum pumps
22 models · 70–7,385 m³/h
Product overview
Semiconductor processes (etch, implant, lithography): all 62 models compared
Use the filters on the left to narrow the selection – by manufacturer, technology and the models’ key figures, for 50 or 60 Hz.
Busch COBRA Semicon series 22 models
COBRA DS 0080 GPumping speed 70 m³/h 50 Hz85 m³/h 60 HzUltimate pressure 0.03 mbarRated motor power 4 kW 50 Hz4.4 kW 60 HzVariants 2
COBRA BA 0100 CPumping speed 85 m³/h 50 Hz105 m³/h 60 HzUltimate pressure 0.01 mbarRated motor power 1.5 kW 50 Hz1.8 kW 60 HzVariants 3
COBRA BC 0101 GPumping speed 90 m³/h 50 Hz90 m³/h 60 HzUltimate pressure 0.01 mbarRated motor power 1.5 kW 50 Hz1.5 kW 60 HzVariants 1
COBRA DS 0160 GPumping speed 140 m³/h 50 Hz160 m³/h 60 HzUltimate pressure 0.03 mbarRated motor power 5.5 kW 50 Hz6.6 kW 60 HzVariants 3
COBRA DS 0700 GPumping speed 500 m³/h 50 Hz610 m³/h 60 HzUltimate pressure 3 × 10-3 mbarRated motor power 8 kW 50 Hz8.8 kW 60 HzVariants 2
COBRA BC 0601 GPumping speed 550 m³/h 50 Hz640 m³/h 60 HzUltimate pressure 3 × 10-3 mbarRated motor power 3 kW 50 Hz3.3 kW 60 HzVariants 1
COBRA DS 0600 EPumping speed 600 m³/h 50 Hz600 m³/h 60 HzUltimate pressure 0.01 mbarRated motor power 15 kW 50 Hz15 kW 60 HzVariants 2
COBRA DS 1000 GPumping speed 775 m³/h 50 Hz960 m³/h 60 HzUltimate pressure 3 × 10-3 mbarRated motor power 8 kW 50 Hz8.8 kW 60 HzVariants 2
COBRA BC 1001 GPumping speed 870 m³/h 50 Hz870 m³/h 60 HzUltimate pressure 3 × 10-3 mbarRated motor power 4.4 kW 50 Hz4.4 kW 60 HzVariants 1
COBRA BC 1200 APumping speed 1,200 m³/h 50 Hz1,200 m³/h 60 HzUltimate pressure 3 × 10-3 mbarRated motor power 5.5 kW 50 Hz5.5 kW 60 HzVariants 1
COBRA DS 1200 APumping speed 1,200 m³/h 50 Hz1,200 m³/h 60 HzUltimate pressure 3 × 10-3 mbarRated motor power 8 kW 50 Hz8.4 kW 60 HzVariants 2
COBRA DS 2000 GPumping speed 1,365 m³/h 50 Hz1,640 m³/h 60 HzUltimate pressure 3 × 10-3 mbarRated motor power 11 kW 50 Hz13.2 kW 60 HzVariants 2
COBRA DS 1800 APumping speed 1,700 m³/h 50 Hz1,700 m³/h 60 HzUltimate pressure 3 × 10-3 mbarRated motor power 8.4 kW 50 Hz8.4 kW 60 HzVariants 1
COBRA DS 1800 A XPumping speed 1,700 m³/h 50 Hz1,700 m³/h 60 HzUltimate pressure 3 × 10-3 mbarRated motor power 10.6 kW 50 Hz10.6 kW 60 HzVariants 1
COBRA DS 3010 GPumping speed 3,200 m³/h 50 Hz3,200 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 30 kW 50 Hz30 kW 60 HzVariants 1
COBRA DS 3161 CPumping speed 3,200 m³/h 50 Hz3,200 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 30 kW 50 Hz30 kW 60 HzVariants 1
COBRA DS 3181 CPumping speed 3,500 m³/h 50 Hz3,500 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 33.5 kW 50 Hz33.5 kW 60 HzVariants 
COBRA DS 5161 BPumping speed 4,300 m³/h 50 Hz4,300 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 30 kW 50 Hz30 kW 60 HzVariants 
COBRA DS 8161 FPumping speed 6,000 m³/h 50 Hz6,000 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 30 kW 50 Hz30 kW 60 HzVariants 1
COBRA DS 9161 BPumping speed 6,220 m³/h 50 Hz6,220 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 35 kW 50 Hz35 kW 60 HzVariants 
COBRA DS 8162 FPumping speed 7,200 m³/h 50 Hz7,200 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 50 kW 50 Hz50 kW 60 HzVariants 
COBRA DS 8163 BPumping speed 7,385 m³/h 50 Hz7,385 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 65 kW 50 Hz65 kW 60 HzVariants Pfeiffer Vacuum A4 series 12 models
A 124 HPumping speed 95 m³/h 50 Hz110 m³/h 60 HzUltimate pressure 0.05 mbarRated motor power Variants A 204 H/XPumping speed 130 m³/h 50 Hz160 m³/h 60 HzUltimate pressure 0.2 mbarRated motor power Variants A 604 HPumping speed 480 m³/h 50 Hz560 m³/h 60 HzUltimate pressure 3 × 10-3 mbarRated motor power Variants A 804 H/XPumping speed 600 m³/h 50 Hz700 m³/h 60 HzUltimate pressure 8 × 10-3 mbarRated motor power Variants A 1204 HPumping speed 1,050 m³/h 50 Hz1,150 m³/h 60 HzUltimate pressure 3 × 10-3 mbarRated motor power Variants A 1504 H/XPumping speed 1,100 m³/h 50 Hz1,200 m³/h 60 HzUltimate pressure 8 × 10-3 mbarRated motor power Variants A 1804 H/XPumping speed 1,650 m³/h 50 Hz1,700 m³/h 60 HzUltimate pressure 8 × 10-3 mbarRated motor power Variants A 1504 XNPumping speed 1,100 m³/h 60 HzUltimate pressure 0.0145 mbarRated motor power Variants A 1804 XNPumping speed 1,600 m³/h 60 HzUltimate pressure 0.0145 mbarRated motor power Variants A 3004 H/XPumping speed 3,000 m³/h 60 HzUltimate pressure 4 × 10-3 mbarRated motor power Variants A 3004 XNPumping speed 2,900 m³/h 60 HzUltimate pressure 4 × 10-3 mbarRated motor power Variants A 804 XNPumping speed 600 m³/h 60 HzUltimate pressure 0.0145 mbarRated motor power Variants Pfeiffer Vacuum A 100/200 L series 3 models
A 100 LPumping speed 100 m³/h 50 HzUltimate pressure 0.012 mbarRated motor power Variants 8A 100 L ESPumping speed 100 m³/h 50 HzUltimate pressure 3 × 10-3 mbarRated motor power Variants 3A 200 LPumping speed 200 m³/h 50 HzUltimate pressure 0.013 mbarRated motor power Variants 5Pfeiffer Vacuum ACP series 4 models
ACP 15Pumping speed 14 m³/h 50 HzUltimate pressure 0.05 mbarRated motor power Variants 9ACP 28Pumping speed 27 m³/h 50 HzUltimate pressure 0.04 mbarRated motor power Variants 14ACP 40Pumping speed 37 m³/h 50 HzUltimate pressure 0.04 mbarRated motor power Variants 15ACP 90Pumping speed 88 m³/h 50 HzUltimate pressure 0.03 mbarRated motor power Variants 6Pfeiffer Vacuum HiLobe series 17 models
HiLobe 1002Pumping speed 1,050 m³/h 50 HzUltimate pressure Rated motor power 2 kW 50 HzVariants 1HiLobe 1004Pumping speed 1,050 m³/h 50 HzUltimate pressure Rated motor power 2 kW 50 HzVariants 2HiLobe 1302Pumping speed 1,300 m³/h 50 HzUltimate pressure Rated motor power 2.5 kW 50 HzVariants 2HiLobe 1304Pumping speed 1,300 m³/h 50 HzUltimate pressure Rated motor power 2.5 kW 50 HzVariants 2HiLobe 2104Pumping speed 2,100 m³/h 50 HzUltimate pressure Rated motor power 3.5 kW 50 HzVariants 2HiLobe 2703Pumping speed 2,700 m³/h 50 HzUltimate pressure Rated motor power 3.5 kW 50 HzVariants 1HiLobe 2704Pumping speed 2,700 m³/h 50 HzUltimate pressure Rated motor power 3.5 kW 50 HzVariants 2HiLobe 4504Pumping speed 4,440 m³/h 50 HzUltimate pressure Rated motor power 5.5 kW 50 HzVariants 2HiLobe 4503Pumping speed 4,500 m³/h 50 HzUltimate pressure Rated motor power 5.5 kW 50 HzVariants 1HiLobe 6203Pumping speed 6,200 m³/h 50 HzUltimate pressure Rated motor power 7.5 kW 50 HzVariants 1HiLobe 6204Pumping speed 6,220 m³/h 50 HzUltimate pressure Rated motor power 7.5 kW 50 HzVariants 2HiLobe 8103Pumping speed 8,120 m³/h 50 HzUltimate pressure Rated motor power 9 kW 50 HzVariants 1HiLobe 8104Pumping speed 8,120 m³/h 50 HzUltimate pressure Rated motor power 9 kW 50 HzVariants 1HiLobe 11003Pumping speed 10,830 m³/h 50 HzUltimate pressure Rated motor power 12 kW 50 HzVariants 1HiLobe 11004Pumping speed 10,830 m³/h 50 HzUltimate pressure Rated motor power 12 kW 50 HzVariants 1HiLobe 14003Pumping speed 13,540 m³/h 50 HzUltimate pressure Rated motor power 15 kW 50 HzVariants 1HiLobe 14004Pumping speed 13,540 m³/h 50 HzUltimate pressure Rated motor power 15 kW 50 HzVariants 1Pfeiffer Vacuum TORRI series 4 models
TORRI BD 0100 APumping speed 100 m³/h 50 Hz100 m³/h 60 HzUltimate pressure 0.01 mbarRated motor power 2.2 kW 50 Hz2.2 kW 60 HzVariants 1TORRI BD 0300 APumping speed 300 m³/h 50 Hz300 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 4.4 kW 50 Hz4.4 kW 60 HzVariants 1TORRI BD 0600 APumping speed 600 m³/h 50 Hz600 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 4.4 kW 50 Hz4.4 kW 60 HzVariants 1TORRI BD 1200 APumping speed 1,200 m³/h 50 Hz1,200 m³/h 60 HzUltimate pressure 1 × 10-3 mbarRated motor power 7.5 kW 50 Hz7.5 kW 60 HzVariants No model matches these filters.
Busch COBRA Semicon series 22 models
Pfeiffer Vacuum A4 series 12 models
Pfeiffer Vacuum A 100/200 L series 3 models
Pfeiffer Vacuum ACP series 4 models
Pfeiffer Vacuum HiLobe series 17 models
Pfeiffer Vacuum TORRI series 4 models
Models a manufacturer no longer carries in its current range are listed in its “Outdated models” section.
Industries
Semiconductor processes (etch, implant, lithography): where the manufacturers name it
The manufacturers list these uses on their own pages.
Semiconductors, electronics and displays
Busch and Pfeiffer Vacuum name the processes for semiconductors, electronics and displays: Busch with the COBRA Semicon series for polysilicon etching and ion implantation, Pfeiffer Vacuum with A4, ACP, TORRI, A 100/200 L and HiLobe for etching, stripping, implantation and lithography.
Frequently asked questions
Semiconductor processes (etch, implant, lithography): frequently asked questions
Which vacuum pump for plasma etching of wafers?
For etching (dielectric, conductor, polysilicon, ALE), Pfeiffer Vacuum names A4 as well as COBRA BC and COBRA DS; as the process pressure, Pfeiffer Vacuum names 10⁻² to 10⁻³ hPa, plus dry backing pumps (600 to 1,800 m³/h) and the ATH-M turbo pump, which is not in our range. Busch lists polysilicon etching with 15 products of the COBRA Semicon series and classes metal etching as a demanding process and oxide and silicon etching as a medium one.
How much vacuum does semiconductor etching need?
For etching and cleaning, Pfeiffer Vacuum names 10⁻² to 10⁻³ hPa, and for stripping and ashing about 1 hPa.
Which vacuum pump for ion implantation?
For ion implantation, Pfeiffer Vacuum names ACP and TORRI (7 products), Busch the COBRA Semicon series (1 product). Busch counts implantation among the demanding processes.
Which vacuum pump for EUV lithography?
For EUV lithography with structures below 10 nm, Pfeiffer Vacuum names a particle-free vacuum and a high H₂ flow in the light source; HiLobe and ACP are named, plus ADH and the HiPace and ATH-M turbo pumps, which are not in our range. For lithography in general, Pfeiffer Vacuum lists A 100/200 L and ACP with 7 products.
Why do semiconductor processes need dry vacuum pumps?
For etching and stripping, Pfeiffer Vacuum explicitly names dry backing pumps, and for EUV lithography a particle-free vacuum. All the series that Busch and Pfeiffer Vacuum name here – COBRA Semicon, A4, ACP, TORRI, A 100/200 L and HiLobe – work without oil in the pump chamber.
Which semiconductor processes are particularly demanding for the vacuum pump?
On its semiconductor page, Busch distinguishes two classes: demanding are metal etching, implantation, HDP, CVD, RTP, epitaxy, SA/MO/PE/LP-CVD and ALD; medium are PVD, PVD pre-clean, RTA, stripping/ashing and oxide and silicon etching. For thin-film deposition, Pfeiffer Vacuum points out corrosive or powdery by-products.
Which vacuum pump for stripping and ashing photoresist?
For stripping and ashing, Pfeiffer Vacuum names A4 and COBRA BC at about 1 hPa, with 600 to 1,800 m³/h, peaking at 3,000 m³/h. Busch classes stripping/ashing as a medium process.
Which vacuum pump for CVD processes such as WCVD or TiN?
For cobalt, WCVD, TiN & TDMAT, Pfeiffer Vacuum names A4, COBRA BC and COBRA DS, and for light-induced deposition A4 and COBRA BC. Busch counts CVD, SA/MO/PE/LP-CVD and ALD among the demanding processes and names the COBRA Semicon series for ALD.
A single pump or a central vacuum system?
A central system in a room of its own keeps noise and heat away from production and matches its output to the demand. Central vacuum systems are planned and built by Eugen Theis Vakuum, a company of the Ehrler & Beck group – more under Central Vacuum.
Does Ehrler & Beck also supply spare parts and service?
Yes. Ehrler & Beck offers original spare parts and accessories as well as maintenance and repair.
Which pump suits your process?
Tell us the application, the medium and the volume – we advise you on selection, spare parts and service.
